You mean, using the top side for VCC and the bottom for GND (or whatever)? Where would signals go?
I normally route two-layer boards as full ground pour, stitched, with signals routed on the top where possible, and supplies on the bottom (invariably, some of both becomes necessary, but that's fine).
I'd kind of like to do a two layer, plane-pair type layout some time, but I can't convince myself that it's worth even trying. As soon as you run
just one trace, at all, anywhere, you have to stitch the same-layer plane by popping vias to the opposite side and making jumpers. Repeat periodically along a bus, and then further, for each bus. Then do it again for the opposite layer. If nothing else, I'm sure you'd waste enough space routing it, that for the area savings versus stackup cost, it'll be cheaper to do it in 4 layers! (Which is really just to say: that's what kind of layout a multilayer stackup is best at.)
Anyway, the lack of VCC plane is almost never a problem; indeed, it may even be an advantage, since the lengthy traces will filter ripple easier, as you are right to be concerned about. It's another good reason to use the stitched ground method, I suppose: there's no paired conductor to form a transmission line, it's just ground all the way. (Save for parasitic waveguide modes between stitch points, but those will all be low impedance, fairly lossy, and extremely high frequency.) There may be ground bounce, but as seen by a local subcircuit, it will manifest as normal mode noise.
If you wanted to use a PLCC or TQFP packaged FPGA at high speeds, on a two layer board, you might have some problems packing in enough bypass caps and vias around the periphery, but for sure, the problem doesn't even exist in denser packages (BGAs) -- because you
must use multilayer boards for those!
Tim