I'm with NandBlog & TerraHertz ,
In the old days, pcbs were made with a thick layer of copper, and it was necessary to etch through the full thickness , consequently you needed to hatch in the fill areas , and also avoid thin tracks running across bare PCB , both ensure a uniform etch and uniform undercut.
Modern day PCBs start with a few microns of copper, and plate up the rest of the thickness so it's really not necessary from that perspective.
And to control warpage you need roughly the same mass of copper on the top as the bottom, and hatching on the bottom (and the top fills) will provide the same average density all over.
I hatch all my fills (10mil track, 20mil pitch), it shows you have put a bit of thought into the PCB design.