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51
Beginners / Re: Chip making process
« Last post by brucehoult on Today at 04:30:17 pm »

The reticles (need two per layer) you need at least 20 depending on the nr of layers, are for the lower layers around $100k/piece upto $300k/piece for state of the art tech.

So what is the terminology is a reticle = a mask?

Normal terminology, as I understand it, is that a "reticule" is a small square(ish) area that is the maximum size you can make one individual chip. That's how big the masks are. Let's say, for example, that it's 25mm x 25mm or 625 mm^2. Your 1mm x 1mm chip gets put somewhere in this area, and the rest is taken up with other people's chips.

Identical reticules are laid out in a grid covering the whole circular silicon wafer. For a 300mm wafer that's about 100 copies. So you end up with 100 chips. On a 200mm wafer it will be about 40 copies of the reticule (if it's 25mm x 25mm there too).
52
Beginners / Re: Chip making process
« Last post by brucehoult on Today at 04:22:35 pm »
It means if your chip (including pads, and I expect a mandatory added unused boundary ring) is smaller than 4 mm^2 then you'll be charge for 4 mm^2 anyway. (EUR 1200)
So If my chip fits in 1mm2 and I'm opting for an unpackaged chip would they still charge me for 4mm^2 per chip and that would mean 4 * 300 Eur = Eur 1200 per chip.
and then they require at least 20 samples to be taken so that would be 20 * 1200 = Eur 24000 for an order.
Doesn't the price range sound too heavy for a university or a research setting?

Packaged or unpackaged is irrelevant to this price. This is, essentially, for your share of making the masks, which is once for all 20 or 40 or 100 chips (depending on the size of the wafers). Plus there's a little bit in there for paying for your part of the wafer and the processing costs, but that's tiny compared to the masks.

So it's EUR 1200, not 20 * 1200.
53
I'm really proud of myself with this hack. It took a lot of work to eventually gain access to the Windows CE desktop on my DSOX1102G. After successfully doing so, I decided to do what needed to be done, making my scope run Doom.

Check out the blog post here:
https://ripitapart.com/2018/10/15/gaining-access-to-the-windows-ce-desktop-and-doom-on-the-keysight-dsox1102g-oscilloscope/

54
Beginners / Re: Chip making process
« Last post by ZeroResistance on Today at 04:16:55 pm »
It means if your chip (including pads, and I expect a mandatory added unused boundary ring) is smaller than 4 mm^2 then you'll be charge for 4 mm^2 anyway. (EUR 1200)
So If my chip fits in 1mm2 and I'm opting for an unpackaged chip would they still charge me for 4mm^2 per chip and that would mean 4 * 300 Eur = Eur 1200 per chip.
and then they require at least 20 samples to be taken so that would be 20 * 1200 = Eur 24000 for an order.
Doesn't the price range sound too heavy for a university or a research setting?
55
Test Equipment / Re: Test Equipment Anonymous (TEA) group therapy thread
« Last post by Berni on Today at 04:16:18 pm »


Working hard does pay off  :-/O Also got 3 500MHz probes and a 250MHz probe for this. They were literally stashed away in a bomb shelter. Now the downsides: It's a LeCroy, the touch screen seems bust and the rotary encoders seem to skip some beats  :-BROKE

Anyone happen to have a service manual for a LeCroy WavePro 7100 running Windows 2000 NT?



Also got some help to organize my rack. Man, these things a way too heavy to work with alone.



Nice rack there! :-+

Yeah some of the heavier gear can be quite the workout to lift and slide into the top locations on a full sized rack.

As for your scope i'm pretty sure some contact cleaner into the encoders will fix them, as long as you can easily figure out how to get the front panel opened up. As for the touchscreen that could be many things, could be the ribbon cable or even the windows drivers (I had problems with those on my Agilent DSO9000). If it is the flex cable from the touchscreen then hopefully its in the FFC connector, but what can also happen is that the bond from the flex cable to the glass panel gets lose. The way to test that is to press the cable against the glass with something and see if it starts working properly. A proper fix for that is sadly a new touchscreen, but you can still try a quick fix of sticking some paper between the case and the cable to press it on, or sometimes heating and pressing it on at the same time can repair the conductive glue bond. You can use a soldering iron with a big tip and set to a pretty low temperature to do that.
56
Repair / Re: Fluke 289 not quite sorted.
« Last post by ElecSeb on Today at 04:16:11 pm »
Q24 & Q27 = SFH 325 FA-3/4-Z - SIDELED® Silicon NPN Phototransistor in SMT SIDELED®-Package
DS01 = SMD LED (exact type unknown atm)
57
Does anyone have any extra LNA PCBs?  I would be happy to purchase them with shipping costs of course.
58
Beginners / Re: Chip making process
« Last post by ZeroResistance on Today at 04:11:33 pm »

The reticles (need two per layer) you need at least 20 depending on the nr of layers, are for the lower layers around $100k/piece upto $300k/piece for state of the art tech.

So what is the terminology is a reticle = a mask?
59
Buy/Sell/Wanted / Re: WBT: JBC T245 Stand
« Last post by ilqpli on Today at 04:08:23 pm »
60
Beginners / Re: Chip making process
« Last post by brucehoult on Today at 04:06:52 pm »
Do these design kits need to be purchased from the foundry? eg. AMS
The PDKs are usually free - these will often include a standard cell library (e.g. basic AND/OR/NOT gates and Flip Flops) and basic IO cells as well, but not always.
They are free because the fabs make their profits selling ICs, and the design kits help customers to use them to make ICs.

From the price list posted above it looks like ON's 0.7u is the cheapest at the moment, only 300 euro/mm^2. So it is possible to do something for only few k$ now, instead of tens or hundreds of k$.

We need to remember that those prices are for untested / unpackaged chips and how to handle unpackaged chips would be another topic of discussion, hope someone puts in more info regarding this.
Plus additional info in the sheet says
OnSemi > 20 samples and
Price = area (mm2) * price/mm2 with min. fabrication cost equivalent to 4 mm2

Now what would the last line mean?

It means if your chip (including pads, and I expect a mandatory added unused boundary ring) is smaller than 4 mm^2 then you'll be charge for 4 mm^2 anyway. (EUR 1200)
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