I would be interested if something like this can be accomplished with FFC containing carbon-based tracks.
I tried to do that same thing once but any temperature on the iron that was able to melt the solder was also melting the substrate as well. Conductive silver paint might be better but not sure how well would that be modeled on 0.2mm.
I will post a picture some time soon.
So I figure tin both, lay them down on microscope glass, align them under microscope, ppress down with another glass and then heat both sides of the glass (while its clamped) so the solder melts and the two pieces fuse, test for continuity with a bee's dick probe then put kapton strain relief.
I figure it should come out to 25$ an hour, if its a 500$ unit....
Or maybe 250$ an hour if the gods look down upon me....