Well I used a 2KW air gun lol..
I have to say you are a brave soul, I'm glad it worked for you. Personally I wouldn't touch bga rework, especially not with multi-thousand ball bga. With my luck the board will delaminate and/or the pads will get ripped off.
Well I did happen to break some pads.. But not on this board.
That`s fixable, you just need steady hands and a good camera/microscope.
And this too:
https://www.zipy.ro/p/ali/0-01-0-02-mm-pure-copper-wire-line-for-fix-repair-iphone-ipad-phone-motherboard-logic-board-pcb-fingerprint-sodering-point-tools/32767228143/ But that happens when you force the chip off the PCB (for various reasons), or when the pad is "pre-broken".
And about the delamination... Never happened to me yet.
But, as I wrote, I used the temp probe from my multimeter, and didn`t go above 240*C and that was for a short time.
Now I`m wondering if I should use solder paste (same I used on phones) or solder balls...
I guess it will depend on the thickness of the stencil.