We are probably all familiar with the Rossmann video on reballing, but I'll link it below just in case.
I have yet to see or hear of anyone actually showing any research, studies, or other types of investigation on the subject. It really seems just like everything else- a strongly worded statement of one's own personal opinion, with nothing to back it up other than a firm conviction. There are plenty of alternative possibilities to what the problems may be, and what heating or reballing the die may actually be doing. Despite the similarities in his logic to those he is disagreeing with, people tend to rally behind Rossmann's opinion on this video. He has not properly disproved the general idea that reballing BGA chips "fixes" them, nor has he supported his own claims about the "little bumps" inside the chip being the actual root cause. His claim that heating the chip well below the point at which solder melts somehow "proves" his point is simply not true.
I am a fan of Rossmann and the lion's share of what he has done on the topic of repair, freedom, and related subjects. His claims may very well be true, but he has not supported them.
What are your thoughts on the topic? Does anyone know of any studies or research that may be more valid-- or any other convincing arguments in general? Any ideas on ways to have a better idea on what is going on, even if it is not quite to a proper scientific level?