Thanks for all the input guys!
I think I'll try this route first:
Low temperature solder paste, hot air and *HOPE* there's enough footprint overlap. If it works, clean up the flux then run superglue under them for strength.
The thing about a respin is that I really don't have time to get this stuff done. Deadline in a few days only. So I'll get on it tomorrow or the next day cross my fingers very hard. It seems to at least be
some overlap.
It's a four layer board, done by MacroFab (so quite expensive per piece, but I've only spent about 10 hours total on them so far so grand total - still cheap), can't afford the time or really the money for a respin.
It's for a client, under the "rapid prototyping" umbrella. It of course means way too little time, and "luckily" also too little money...
Thanks again guys, I'll find a way. When I do I'll take a photo of the nightmare here