Interesting thread this.
For TH, I’ve been using a variation of Manhattan style which relies on the components being mounted almost legless and flat between the islands which are carefully spaced to make sure there is just enough room. This removes all those neat but electrically horrible excess inductors everyone leaves on one end of a component and decreases the weight of the final assembly. Similar to what you found in old point to point wired equipment but without the rat’s best.
I call this Endor style after the Ewok’s tree houses in Star Wars.
BUT honestly there’s not much point in using crappy old TH components now for ham stuff at least unless it’s high power now. And almost definitely not for anything VHF and above. And manhattan is ugly as sin and extremely difficult to modify once done because of all the glue stuck all over the ground plane.
Just draw the sub unit schematic out (say an LPF), cut some square islands in FR4 with an X-Acto and just bridge the gaps. No messy glue, cheaper and smaller. SMD stuff costs bugger all as well, even the brand name stuff. When you have a sub assembly working, glue that to another bit of FR4. It also acts as a very convenient low impedance star topology ground.
Typical module (10Mhz VCTCXO + power supply):