Chipquick will amalgamate with the existing solder to make it a very low melting point alloy that then is easy to remove with low temperature. A small roll will cost, but for this it probably is worth it. You just need to use solderwick and extra liquid flux afterwards to get it all off, then retin the pads, clean again with solderwick, retin then place the new device and just reflow the solder using more flux. Then clean the area with IPA and it will be done.