Standard Hybrid chip there, though it is soldered in upside down so the ceramic case side is a heatsink mount. Inside there will be a white ceramic multilayer substrate, gold traces in multiple layers and silver soldered chips on the ceramic with gold bond wires, along with thick film resistors, diodes, transistors and probably some matched length traces to pass the high speed signals through the glass seals, along with likely some ceramic chip capacitors and some solid tantalum, most likely wet tantalum, decoupling capacitors soldered to the board.