Damn these little BGA's, lol.
VIPPO is where there is a BGA pad on the surface of the PCB, but then there is a filled-in via underneath that runs through the PCB. It's the only way to fan out small BGAs - not enough room for a dog-bone pattern. But, there doesn't seem to be obvious way to combine a pad and a via in Altium to produce a VIPPO. The 3D render and Gerbers show a hole if I just put a via over a pad. Another way - a multi-layer pad with a through hole also doesn't have an option to plate over the top.
Any tips? This seems to be pretty common but a first, for me.