I need to defrost a glass cylinder when a camera system boots up in winter. The idea is to cover the non-visible half of the cylinder with a semi-flex or flex pcb with the 10 Ohm track on it and use the transferred heat to defrost the glass.
Remember to open up the solder mask so that the heat can get out (this will reduce the life of the copper however if you overheat it).
Wouldn't recommend this. Solder bridges or extra conductor thickness (HASL or otherwise) or just shorting that'll later require an insulator anyway, are all ideal reasons to keep it.
We're not talking vaporizing heat here. If we were, FR-4 would obviously be the wrong substrate to do it on!
Good engineering practices would say "why not use a number of low resistance resistors at regular intervals to generate the heat." At least you know that the resistors are designed to reliably dissipate the heat on an on-going basis.
I know I would definitely prefer to buy a camera that was designed this way.
Agree, this would be something more of a 'gold standard' approach while still involving PCBs. The uneven surface would be annoying, but a thermal pad could fill in, for example. There's also the possibility of flex PCB, using traces or resistors (but do mind the trace version is flexible while the resistored version is limited).
Tim