Help required in ground planes interconnection

[sanwal209]

Hi everybody,
I am designing a board which contains a RF MCU(EFR32MG1) and a lot of digital circuitry (Not very High speed). PCB consists of six layers.   2nd Inner layer is continuous ground which is requirement of Co-Planner transmission line. My question is can i connect the digital ground vias of digital components on top layer to the RF GND plane? or should i connect all digital vias to the other ground plane and interconnect both ground layers at ground pin of power input connector.
Please help me out here
Thanks

[sanwal209]

I exactly did the same as you recommended. Width of the Transmission line is .6 and clearance is .5 as this was output values from co planner wave guide calculator. Please do check the attached PCB design. Is it fine ? or do i need add more stitching vias

[sanwal209]

Thanks.

[T3sl4co1l]

At a glance, R14/R15 don't even have a ground connection.

"Stitch heavily" means the whole damn board!

Tim

[sanwal209]

Thanks man but R14/R15 are connected to ground via(Zoom in). I will update as soon as i put stitching vias all over the board. Due to massive routing on inner signal layer i am not able to put massive number of stitching vias from top layer to bottom. But what i can do is i can put stitching vias from top to RF ground layer. Does this work?