So, long story short, I've just got my first "professionally" designed and manufactured PCB for a school project. (hence the switch to SMT parts from hobby level through hole stuff)
I've chosen 0805 sized passives for the sake of hand soldering. I have some experience soldering SMT parts before. (mainly SOIC and QPF on breakout boards)
I seem to find myself having a tough time soldering pads that are connected to heat sucking ground planes, I literally have to crank my iron up to 430 degrees C for the solder to flow nicely.
The solder that I am using is just the cheapo 60/40 0.6mm diameter solder from my local electronic component shop. As for flux, I am just using paste flux.
The soldering tip used was one of those chisel tips, although its probably too big for SMT parts. (the Hakko T12-D12 tip is on its way from eBay)
Here are some pictures of my board. (see how one pad on C10 is connected to the ground plane)



Is the thermal capacity of my soldering iron too low? Or will the new tip that I just ordered do the trick?
Pads that just connected to traces seem to solder quite nicely at 330 degrees C.
Or should I just get some solder paste and mod a toaster oven?