Electronics > Beginners
Avoiding solder blobs on 0603 when handsoldering.
hamster_nz:
Does anybody have any hints on avoiding 'blobby' joints on 0603 passives?
I'm currently using 0.71mm leaded solder, a 0.5mm conical tip, iron set to around 310 C
Problem seems to be that when the wire melts, it melts too much, giving approximately twice the solder that I really need.
I find paste in a syringe is pretty messy to work with, and don't like the idea of having little balls of solder smeared over my projects.
I have looked for thinner solder maybe 0.5mm, but it doesn't seem common, so I assume I am doing something wrong. I would include a photo, but am too embarrassed. :palm:
JustMeHere:
More flux will help.
I use paste. Just brush the extra balls away. You could try using a bevel tip. It's good at removing extra solder across it's broad face.
james_s:
I use thin solder, and I just touch it to the tip of the iron for a moment so it only melts off a little bit.
TheHolyHorse:
I use 0.38mm solder for all my SMD soldering, never soldered anything smaller than 0805. Finding 0.38mm solder shouldn't be an issue.
Combine the previous tips with thinner solder and you'll probably be good. Of course practice will refine your technique so that's not a bad idea either.
ataradov:
I solved this problem by not overthinking it. I do get more solder than I want on 0603 parts, and I simply don't care. It looks meh under the microscope, but looks fine to the naked eye.
It obviously depends on what you understand under more solder than you want. I'm talking about solder joints like this
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