Author Topic: BGA fanout and soldering  (Read 657 times)

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Offline ealexTopic starter

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BGA fanout and soldering
« on: January 28, 2020, 07:39:30 am »
Hello

I'm trying to start my first project with a BGA package - a Cyclone iV EP4CE6F17C8 (i'll start another thread for the project - might be interesting for someone)
The package used by that chip is FBGA-256: page 10, figure 6 from https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/an/an114.pdf
It looks like it's quite a big package - and I don't plan to use all the pins, but the more I can fan out, the better, as a prototype board
(i'll try to use a 4 layer board)

I've gather the following clips to help me with the layout:
EEVblog #193
EEVblog #1029

Regarding soldering: will a hot-plate be enough for this ? I assume the BGA package will come pre-balled - i'll only have to re-flow it to the board:



Can you recommend some other resources ?
 

Offline kizmit99

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Re: BGA fanout and soldering
« Reply #1 on: January 28, 2020, 04:07:57 pm »
I've used a variant of that same part (in the same package) and reflowed it successfully using a Controleo3 managed toaster oven.  So, not a hot plate but probably something close to the same level of technology.  I've done 2 boards with that chip and didn't have any issues getting it to soldered successfully.

Just a data-point.  Good luck.
 


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