Hello
I'm trying to start my first project with a BGA package - a Cyclone iV EP4CE6F17C8 (i'll start another thread for the project - might be interesting for someone)
The package used by that chip is FBGA-256: page 10, figure 6 from
https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/an/an114.pdfIt looks like it's quite a big package - and I don't plan to use all the pins, but the more I can fan out, the better, as a prototype board
(i'll try to use a 4 layer board)
I've gather the following clips to help me with the layout:
EEVblog #193
EEVblog #1029
Regarding soldering: will a hot-plate be enough for this ? I assume the BGA package will come pre-balled - i'll only have to re-flow it to the board:
Can you recommend some other resources ?