Author Topic: BGA removal  (Read 1989 times)

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Offline zerorisersTopic starter

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BGA removal
« on: July 13, 2015, 05:12:53 pm »
Hello everybody. I have recently purchased a hot air rework station from frys, but I must know. what would be the best way to preheat the board before attempting to use the hot air gun to remove the BGA device? IR or hot air? I will be doing all work in a small room that is about 8"x10" so heat up of the room itself is an issue as it is a bedroom. i have about a 2.5" x 1.5" space to work with.

Thanks in advance, zerorisers.
 

Offline John_ITIC

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Re: BGA removal
« Reply #1 on: July 13, 2015, 06:07:44 pm »
"It depends" (on what size your BGA is and what your board size is).

With a hot air station, you will most likely not be able to control the heating of your board/BGA properly, resulting in delaminated PCBs.

I have one of these for the explicit purpose of desoldering/soldering BGAs in a prototype environment (same setup as in the picture):
http://www.zeph.com/zt-7.htm
Pocket-Sized USB 2.0 LS/FS/HS Protocol Analyzer Model 1480A with OTG decoding.
Pocket-sized PCI Express 1.1 Protocol Analyzer Model 2500A. 2.5 Gbps with x1, x2 and x4 lane widths.
https://www.internationaltestinstruments.com
 

Offline kripton2035

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Re: BGA removal
« Reply #2 on: July 13, 2015, 06:39:53 pm »
I bought a yihua 853AA for this purpose
an ir plate under the board I heat to 200°C, and the hot air gun above the chip at 300-350°C depends on the size of the chip
works nice. the station paid itself already 6 times ... ;)
 


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