Electronics > Beginners
Chip making process
srce:
--- Quote from: jmelson on October 17, 2018, 01:05:21 am ---
--- Quote from: brucehoult on October 16, 2018, 10:03:50 pm ---I've heard that there's no choice on multi-project runs as they are different size and shapes packed in and sawing up the wafer to extract some of the dice destroys other nearby ones. It's cheaper to pack them in and make multiple wafers than to align everything in rows and columns the size of the largest die in each row/column plus margin for the saw.
--- End quote ---
On educational projects at MOSIS, they have more restrictive rules. For commercial MPW projects, you set the size of the chip. They will often build it slightly larger, to accommodate the sawing operation, but charge you by YOUR specified dimensions. But, all our chips came out about the size we specified.
They obviously have some special tricks they use in the sawing operation to make this work.
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It depends on the foundry, but quite often, you pay per fixed block size, regardless of the size of your die. The block sizes specified by MOSIS and Europractice are just based on what the foundry offer, except that they sometimes they further subdivide them (E.g. Europractice's mini@sics).
srce:
--- Quote from: ZeroResistance on October 17, 2018, 06:20:11 am ---These are wafer cost's from year 2014
for 200mm 0.35u it shows as USD 460.
Taken from http://www.icinsights.com/news/bulletins/LeadingEdge-IC-Foundry-Market-Forecast-To-Increase-72-In-2014/
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Here's the figures for this year
But you probably aren't going to see prices like that. :P
ZeroResistance:
--- Quote from: srce on October 17, 2018, 09:20:00 am ---But you probably aren't going to see prices like that. :P
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How much would you multiply the $ figures with to get a realistic value. And here I'm talking about regular foundry orders and not MPW.
coppice:
--- Quote from: srce on October 17, 2018, 09:20:00 am ---Here's the figures for this year
But you probably aren't going to see prices like that. :P
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There are two issues to note with those prices:
* They are baseline prices for the simplest of logic wafers. If you are doing ultra low power, or mixed signal, or anything above minimal CMOS logic, there are more masks, more processing steps, and more cost.
* They are for customers with high run rates, and huge amounts of in house expertise, whose customer service costs are the lowest possible..
ZeroResistance:
So at the lowest level which among these can have the lowest feature size, diode, BJT, N Mosfet, P Mosfet. I mean in what order are the sizes of all these compos at the fabrication level?
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