the datasheet wants low impedance loops, so you shouldn’t have skinny thermal relief. thermals are to make localized soldering easier, but you already have large pads you can’t reach with an iron. If you’re doing stencil + reflow, then you don’t need thermals. If using hot air, plan to solder that entire loop at the same time.
The data sheet uses a solid fill, too, and I don’t think I would stray from their recommendation in that respect either