Following the EEV video above, using the same technique (in the video it uses a flat tip, I used the concave tip), I was able to solder an IC with pitch 0.80.
Now I could see how the ChipQuik flux does its job, helping in soldering; but especially where there is a need to touch up some badly soldered pins, prevent the tin from creating bridges between adjacent pins.
My concave tip measures 3.2 mm, I would say maybe too big (maybe I would have done better to take the 1.6mm one), more than anything else if there was another smd close to the pins it would be difficult to pass ...
It is then difficult to evaluate well if the pins are soldered with sufficient tin or not, if in doubt, in addition to plugging above the soldering points as in the video, I went over all the pins by dragging the tip from the body of the IC towards the terminal part of the pins; however, this has also drawn tin in the peripheral areas.
Anyway, I then tensioned all the pins with tweezers, and they turned out to be pretty firm (except one that was broken earlier).
One thing I have noticed with this flux is that the solders are bright / bright silver, very good.