Please remain calm and don't panic. There's nothing to fear.
You’re wrong about this, as this is repeatable, observable behavior
This is repeatable, observable behavior. When you tin a thin pointy conical, the bead crawls up off away from the point. I agree with this. So we agree?
Heat struggles to get to the very point
When touching the tip to a board/joint that is sinking away heat, yes. I agree. The skinnier and longer the point on that tip, the greater the thermal gradient between the base of that tip and the point. (But when the tip is in free air while you are just tinning it, this is not a very large gradient. Perhaps we still agree, or maybe not?)
... so when tinning, you end up with the solder forming a droplet above the very end
This is the part I don't agree. I'm actually shocked you still believe this after we had such a nice and civil thread a couple years back (and nearly became friends, until I inadvertently offended you by being myself).
And yes, I got your nice PM. But you asked me to never PM you again, and I continue to abide your wish.
I appreciate your presence on the forum. From what I know, you are a great person. Peace.