As per subject, if one has an NFC antenna on a PCB, does the board need to be of impedance-controlled construction? We're talking typical 2-layer boards, nothing fancy.
Initially, I would have guessed "no", because as far as I understand, your typical NFC antenna design always has no ground plane underneath (or around) it, so how can the substrate characteristics matter?
However, I've been looking at a reference design for an NFC controller, and the design files for the PCB layout do specify a particular PCB material and stack-up (Isola FR-370HR, each layer 1.5oz plated, core 0.058" 0.5oz), as well as an impedance for the antenna traces ("50 ohms +/- 10% ... referenced to layer 1 ground"). I'm wondering whether this is to do with the fact that the antenna design they've implemented on this reference design is not single-sided, but rather has traces across both sides. It's approx. 3.5 turns total, with the first 2 turns on the top side, and the remainder on the bottom. For an antenna of this configuration, is a controlled-impedance stack-up of significance because of turns overlapping each other, or is it just the chip vendor being overly-specific with their manufacturing instructions?