Removing glued(?) IC

[olewales]

Hello, I need some practical advice.
I am trying to remove damaged IC from PCB, but it seems to be glued to the PCB. It's this device. In the pin diagram (page 17) there is a pad in the center but it is not a large package and even though I am practically touching it with hot air nozzle blowing at 400degC I cannot get it to move. How do you usually approach this? I was trying to be neat but honestly I don't care if I damage the pads - I won't be replacing the IC. (just trying to repair the router. IC is running hot, loading 3.3V rail and not working anyways. I can disable this PHY when building new firmware). Should I just cut the traces around and not bother with desoldering anymore?

[radar_macgyver]

If it's got a center pad, it's likely not glued. A hint that parts are glued is to look for nearby passives, if you can see the (usually red) glue underneath, then the other parts may be glued as well.

Most likely you're not applying enough heat to the part. The EPAD will be soldered to the ground plane, which is drawing heat away from the IC. Just keep at it for a while, maybe at a slightly lower temperature than 400 C. When the board is nicely heated up, ramp up the temperature and focus the hot air on the IC alone.

[KL27x]

Blowing at 400degC I cannot get it to move. How do you usually approach this?

Turn the temp and/or airflow up. I've turned mine up to 480 for a small chip. It is very dependent on the board/pour.

[Richard Crowley]

Your data sheet shows that chip has a GIGANTIC thermal/ground pad on the bottom. Even if you could successfully detach ALL the pins around the edge, you would still have a very challenging task removing the chip without damage to the PC board and/or adjacent components.

If the chip is really dead and must be removed, you could cut off all the legs from the package with a hobby knife. Then you could pretty easily de-solder/remove them individually.

[olewales]

I MADE IT! You were right, it was not glue. Just a soldered ground pad
I know that swearing is not very professional but... fucking hell. This was a nightmare.
I was a bit skeptical about what Richard said, I mean: this is a 7x7mm part. How hard can that be?!
Well, it took 40W iron @400deg heating PCB ground pad from the bottom (was looking at PSU current so I know it actually delivered about that much power) and hot air on the top at the same time. And even then it took quite some time and still needed to gently pry chip off with tweezers.

I know about thermal mass but I'd never think that this pad could conduct so much heat out so that IC so small could resist hot air gun. Well, it's never late to learn.

Thank you all for responses guys!