I'm checking all the components one by one, for now I've reached after the large capacitors and everything seems ok (in moments of short circuit they drop from 310 to 200 DC, but I think it's normal, I also have the lamp in series).
When I get to the power components (mosfets, diodes, transistors, voltage regulator), I will disassemble them from the board including heatsinks, for better control.
For each component that I desolder, I will test the board under voltage to see if the occasional short circuit will disappear, in this way I should limit where the problem lies.
Some doubts:
-I didn't understand why they fixed the large heat sinks with copper rivets, in this way, for example, the leveled voltage of 310DC that reaches the drain of 4 mosfets, we also have it on the entire heat sink (I don't understand this choice).
-I read that desoldering/soldering the mosfets could ruin them, are perhaps precautions needed in this regard? Is the classic CPU thermal paste used between the heat sinks and the MOSFET body?
-the only components that I hope do not have problems are the two chips on the hybrid board (Lm324 and TDA1060), I will have to find a way to verify their integrity carefully before changing the other components of the board...