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| ataradov:
Now order it. I still have doubts about the logo and its fine lines, but it would not affect functionality, so who cares. |
| james_s:
I would still make the traces thicker, at least those that are carrying significant current. What you have will work, but there's space to make them easily twice the width you have without issues. |
| MarkF:
I might suggest that you try to keep each circuit trace on the same side of the board if possible. Edit: Of course you do have to balance that with how they divide up the copper pours. |
| MarkF:
I don't want to bash your PCB. Just thought you might want to see what's possible with a little component rearranging. You could get all the traces on the top layer and a solid ground plane on the bottom layer. One last comment: You didn't provide any mounting holes. |
| tautech:
I'd suggest you add some component polarity identifiers into the copper so not to rely entirely on the silkscreen. Square pads for: Diode cathode Electrolytic cap positive You can also add symbols for specific component pads into the copper, K, +, 1 or even just a dot that signifies pin 1 on an IC. Big list only restrained by your imagination. In fact, anything you might have as silkscreen you can have instead in the copper. Bigger pads for IN and OUT. Optimize hole sizes to suit componentry. C1 and C2 pad annular rings need enlarging. Always think; Rework, does my layout improve or hinder it. Are annular rings robust enough to not lift as a result of component substitution or replacement. Agree with MarkF, this could easily be done on a SS board with just thoughtful component orientation to allow simple routing pathways. Great improvement from your first attempt Tom. :-+ |
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