Solder doesn't really stick that much to FR4, the main aspect solder mask helps with is keeping the pad area fenced against the connecting trace. Otherwise, the copper trace would wick the solder alloy away from the pad and you'll likely not get a sufficient fillet. With that in mind, solder mask between pads is not all that important. On the contrary, it's better to have no solder mask at all instead of small slivers of it flaking off because they don't stick to the FR4 during reflow.