The specification of max. power dissipation of a resistor is always coupled with its max. body temperature and in turn with its stability.
These parameters also depend on the technology (Thin Film, Thick Film, or others), and the case size.
For SMD components, the cooling pads on the PCB play an overwhelming role in the cooling aspect.
Small resistors can not transfer as much heat over their soldering junctions, than bigger ones, and heat up more, reducing their max. power, although the naked components may have the same specification.
Here's an example for leaded resistors, with randomly chosen values:
If you have a thin film (precision) resistor of a certain case size, you may apply 0.25W for 125°C max. hot spot temperature, which gives 0.1%/yr. stability, and 0.4W for 155°C hot spot temperature and 0.5%/yr. stability ("Power Mode").
Thick Film resistors of the same case size may even allow higher power dissipation, first due to the higher robustness of the "Thick" film, and second, because thick film resistors are mostly less stable, anyhow.
The specification of the manufacturers are mostly valid for the naked component only, but do not account for the cooling problem by air flow or by PCB cooling areas.
These arguments may well explain the characteristics of your resistors.
Frank