I'm working on a 4 layer board. The stackup is top signal, 2nd gnd, 3rd +3v3, and bottom is signal.
If I did a full copper pour on the top and bottom layers, will I need to worry creating loop area problems? It doesn't seem like it should as long as I keep my 2nd layer as solid as possible (i.e. vias/pin holes only) I'm trying to get better cooling for my power and main processor.