Author Topic: Is Broken top/bottom ground plane ok if you have a solid interior one?  (Read 1109 times)

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Online JustMeHereTopic starter

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I'm working on a 4 layer board.  The stackup is top signal, 2nd gnd, 3rd +3v3, and bottom is signal.

If I did a full copper pour on the top and bottom layers, will I need to worry creating loop area problems?  It doesn't seem like it should as long as I keep my 2nd layer as solid as possible (i.e. vias/pin holes only)  I'm trying to get better cooling for my power and main processor. 
 

Offline OwO

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It is fine as long as you stitch the top and bottom ground pour to the real ground plane with a via every centimeter or so. Otherwise it's possible to get resonances depending on the shape of the ground pour.
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Online T3sl4co1l

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I normally don't worry about outside ground fill at all, if there's inner planes. :)

I only do that when heatsinking or current capacity is required, or -- more as superstition than proven benefit, mind -- where high precision or high frequency circuits are used.

Tim
Seven Transistor Labs, LLC
Electronic design, from concept to prototype.
Bringing a project to life?  Send me a message!
 
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Online JustMeHereTopic starter

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Quote
I only do that when heatsinking

Heat sinking is specifically my goal.  I'm trying to cool an ESP32 and a LT3509 power supply.

Thanks
« Last Edit: March 26, 2019, 02:51:45 am by JustMeHere »
 

Online JustMeHereTopic starter

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It is fine as long as you stitch the top and bottom ground pour to the real ground plane with a via every centimeter or so. Otherwise it's possible to get resonances depending on the shape of the ground pour.

Excellent answer.  Thanks
 


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