That is 500um pitch, no different than most SMD components like QFNs.
And only 11 balls. And probably inexpensive enough that you could experiment with a few without too much loss.
So yes it should be possible.
You ought to use a proper stencil with the right thickness and geometry and the matching type of solder paste and reflow profile. But even if you just tried to reflow it with manually applied paste or wetted planarized pads I imagine that you'd get successful soldering most of the time. Obviously you'd have to be careful with placement to a degree and not allow it to be moved by tilting or vibration during reflow. Even so I bet you could do it with a hot air rework tool.
Give it a try.
ENIG PCBs would be best. I don't know if you can route breakout traces properly on your PCB with that geometry though but give it a try.
I wonder why you are concerned about an EMI protection IC that is relatively difficult to use, though, I would think there would be easier solutions for that particular concern.
Is it possible to solder something like STM EMFI02 at home? Assuming I can screw up several times before I get it of course.
While bigger BGA packages can be soldered manually(like Louis shows below), this is flip chip and damn small one, so I suspect it is more touchy about temperature profile, positioning etc.
Should I even consider to buy it and try to solder with hands or better forget about it and find more suitable package IC?
And while we're at it - maybe somebody knows good and simple ESD usb protection IC like EMFI02?