With uC designs, always make a big as possible GND pour on the bottom layer (or opposite of the layer of the uC).
Then you can also remove the silly GND pad just under the uC, and use that for routing signals, or for a solid power supply distribution for all uC power pins.
The whole PCB needs this GND layer, even under all the buttons.
All the wires to the buttons are antenna's and they pick up external noise (which may be bad enough to disrupt the uC firmware) and they also radiate the noise generated by the uC.
For an example you can look at the GH60 project:
https://kicad-pcb.org/made-with-kicad/gh60/4-layer boards often have a dedicated layer just for GND. On a 2 layer board you do the best you can.
GH60 for example has GND pours on both sides, and then the top layer is used for horizontal wires, and the bottom for vertical wires. This leaves wide bands for GND on both layers, and these are stitched together with via's.
From an EMC point of view the board is far from optimal.
The most critical section around the uC itself does not have anything resembling a GND plane, and I would have liked to see at least 3 via's in the GND planes for each key to stitch them firmly together.