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Newbie wanting to build boards
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greencardigan:
Hi,
I want to build the following two boards.
 
https://github.com/greencardigan/TC4-shield/blob/master/hardware/TC4/TC4%20V600/tc4-controller-0600-brd.pdf

https://github.com/greencardigan/TC4-shield/blob/master/hardware/ZCD/V006/zcd-brd-006.pdf

Will I be able to build these using an iron and/or hot air reflow? Or will I need a reflow oven?  I’d probably use larger SMD diodes on the ZCD board.

I’ve not done any SMD parts or boards before but have reasonable soldering iron skills.

Depending on how I go, I may make boards to sell in limited quantities.  Would that change the ideal method for populating the boards?

Background: These boards used to be available for purchase and used in DIY coffee roasting setups.  They are currently not available for purchase and I want to make them available again to the community.  I am currently ‘responsible’ for the open source code repository developed in conjunction with these boards.

I’m open to building a reflow oven if definitely needed.  I should be able to use my coffee roaster controller (using the TC4 board) to do reflow profiling.

Cheers,
Brad
Wimberleytech:
With transfer paper, good laser printer, an iron...a steady hand--yes.  There is one part on the first board that would be hard for me (RN1), but since I use coffee as an upper and wine as a downer, it is hard to find the precise time for me to apply a steady hand.
greencardigan:
Thanks, I should have mentioned I would likely get the boards made at elecrow or similar.
greencardigan:
So I understand you are saying I don't need a reflow oven and I can solder it all with a hot air reflow station?
Vic20:

--- Quote from: greencardigan on February 21, 2018, 03:13:28 am ---Will I be able to build these using an iron and/or hot air reflow? Or will I need a reflow oven?  I’d probably use larger SMD diodes on the ZCD board.

--- End quote ---

I don't think an oven is really needed for that.
You can probably solder all components using a hand solder and a lot of flux.
O have done that up to TSSOP pitches with no problem.
For SOIC pitches there is no problem at all.

You can use hot air, but I don't think it is really needed for exposed lead components. I only really need hot air for unleaded components like QFNs.

Having soldermask on the board helps a lot as also helps using custom footprints that take into account that the board will be hand soldered.

It all depends on volume. Reflow is good for high volume as you solder all components at once.

One problem with oven reflow is that it requires solder paste and when it expires after some storage time it can give unreliable soldering.


--- Quote ---I’ve not done any SMD parts or boards before but have reasonable soldering iron skills.

--- End quote ---

It is not that difficult, really.
You just need to use the proper thecniques.


--- Quote ---Depending on how I go, I may make boards to sell in limited quantities.  Would that change the ideal method for populating the boards?

--- End quote ---

Yes, because the soldering method affects the time needed to assembly each board.
For medium volumes, having a solderpaste stencil and a reflow oven can come handy for boards with a lot of SMDs.

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