I made a bonehead move on my PCB design. If you look at the image below, you can see that I put a GND via (tented) underneath a VDD pin. The VDD pin that is above the GND via is not used (ie: no solder on the pin at all and no corresponding pad underneath of it). only the corner VDD/GND pins are actually used/soldered.
What I SHOULD have done is swapped the GND/VDD planes and made the via for the VDD rather than the GND... but such is life and I now have 40 PCBs with this design.
The PCBs are a simple LED matrix board. Each LED is capable of max of 60mA at 5V.
So, my question is, can I still use these PCB boards? Will the solder mask provide an adequate/workable insulation between the VDD pad and the via?
I know this isn't a good solution, nor is soldermask rated as an insulator as it can have air-pockets/pin-holes, etc. This I know.
My question is, do I need to scrap these boards, or will it (while not recommended) be ok for the application?