Hello,
What follows is my non-engineer take on high reliability soldering. NASA soldering standards were quite high indeed. I had to be re-certified each year for the 15 years that I spent in the Aerospace industry as an electronic assembly technician (some of the GPS satellites have my fingerprints on them). It was a fascinating experience.
The finished circuit boards had to be extremely clean so that the conformal coating would adhere properly to them, and also so that any residue on the PCBs wouldn't outgas when up in the vacuum of space.
Space is a pretty hostile place for electronics. First, many of the satellites had to survive the incredible vibration level of launch when they were sent up on the nose cone of a rocket. The electronics also had to survive high radiation levels, wild temperature swings, and the effects of vacuum while up in orbit.
As shown in the video, component lead forming was also important so that you did not stress the area where the leads met the component body.
Special end-cutters were used to cut the component leads to a specific length before soldering (0.040" in the cutters shown in the link below). They cut the lead without sending a shockwave up the lead to the component body. Back when I was doing this type of work, many of the chips on the boards had fragile glass seals where the leads entered the chip's body.
www.hmcelectronics.com/product/Excelta/530E-US?referrer=googleshopping&gclid=CJC726j167cCFY-Y4AodgUwApgLike anything else, with some experience, component tinning, forming, lead cutting, and soldering went fairly quickly (much quicker than what's shown in the NASA solder training youtube video, or they would still be building Sputnic 1). The completed boards were cleaned in a heated vapor, degreasing tank and rinsed in alcohol.
Regards,
Frank
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