Please post the
current version of the schematic, so we can be sure you've correctly fixed the errors in the
old one.
This board would likely not perform very well, because you're creating at least one ground loop in the most critical area: the feedback loop. The datasheet says "Place the optocoupler physically close to the TinySwitch-4 to minimizing
[sic] the primary-side trace lengths." But its emitter goes to a via down to the ground plane, which in turn doesn't connect to the ground on the top layer anywhere except at C2 (and L1), resulting in a
shared path for the current to the source pins of the IC: the current from C2 and the current from the emitter of the optocoupler are sharing the same exact path, which is
precisely what the datasheet is telling you to avoid!
FYI, this board doesn't need to be 4-layer (in fact, their example layout is for 1 layer, since power supplies are usually made on single-layer PCBs to save cost), and while 2-layer and 4-layer can simplify many designs, if you don't know what you're doing, then they can also be a source of problems. Ground pours make a lot of things easier, but one risk is that you can end up with pins that are connected, but only through a very indirect, meandering path. (This would be obvious when drawing traces without a ground pour.)
At minimum, if you're going to use a 4-layer board with pours, then you must ensure that everything that connects to a pour actually has a direct connection to the pour. THT components get this automatically, but for SMD, you must place vias (generously, for high-current nodes) immediately next to the pads.