I agree with SJ that dead shorts are virtually impossible to find with a thermal camera. That is unless the short is on the output of an active device (in which case it will help to localize from the last overheating part upstream, but not the actual short), or, if you are very lucky, the shorted component is connected via very thin traces. A dead short, by definition, will dissipate no power and generate no heat.
Thermal imaging and 4-wire resistance measurement are entirely complementary fault location methods. A thermal camera may help to quickly localize the fault area, but then 4-wire resistance measurement will allow localization down to the actual short point.
4-wire measurement is as simple as putting a constant current (bench PSU in current limit mode) across the shorted rails / signals and then probing (with an, as sensitive as possible, mV range meter) to locate the lowest potential difference, making sure that you do not share current and sense connections. It's a very easy, and relatively quick method with a little practice.
In the absence of one or other measurement capability, the 4-wire method wins. It can do what a thermal camera in isolation cannot do, but not vice-versa.
I am intrigued by your naivety, quince. [Ed:combative]