Electronics > Beginners
Who inventes SOIC16?
chris_leyson:
By todays standards SOIC is huge and even MSOP seems big in terms of board space. With a good magnifier a fine soldering iron tip and 0.25mm or 0.3mm diameter solder you will find it isn't too bad. I've been re spinning a board design where most of the packages are 0.5mm QFN or DFN and the "biggest" package is 6pin SOT23 which I have to change to DFN if I can find an alternative part. It's even getting to the stage where I need to look at "hole in pad" PCB manufacturing to gain some additional board space. I'm finding the hardest part is getting good results from the paste stencil and then hand placing all the parts.
uc:
The conclusion of my Q is that I feel really behind regarding electronic technology.
I probably will stay at “through hole to surface mount” and SOIC until am master it.
But I must make an amusing comment.
So if I understand the correct technical progress toward future! 8)
In order to soldering the next generation electronic components I need:
1. Electron microscope
2. Soldering iron tip of 200 nm
3. Steady hand
Take care
wraper:
--- Quote from: uc on June 02, 2018, 02:48:06 pm ---In order to soldering the next generation electronic components I need:
1. Electron microscope
...
--- End quote ---
Sure you don't need that (look at the picture). Even if you meant digital microscope, it sucks for soldering. Optical stereo microscope is much better for the task.
EDIT, ok I didn't get the joke because missed iron tip size. But seriously, there are a lot of components which are just a bare silicon die (second pic) and they are soldered a usual way. By usual I mean reflow soldering. I hand solder them with hot air without an issue. Soldering iron is completely useless for any BGA or LGA type package (unless you make a dead bug).
bitwelder:
--- Quote from: uc on June 02, 2018, 02:48:06 pm ---In order to soldering the next generation electronic components I need:
1. Electron microscope
2. Soldering iron tip of 200 nm
3. Steady hand
--- End quote ---
Perhaps you can also start to dab (pun intended) into solder paste and ways to reflow it.
Warning: a steady hand is still required, unless you can afford a P&P machine
uc:
--- Quote from: bitwelder on June 02, 2018, 03:13:02 pm ---
--- Quote from: uc on June 02, 2018, 02:48:06 pm ---In order to soldering the next generation electronic components I need:
1. Electron microscope
2. Soldering iron tip of 200 nm
3. Steady hand
--- End quote ---
Perhaps you can also start to dab (pun intended) into solder paste and ways to reflow it.
Warning: a steady hand is still required, unless you can afford a P&P machine
--- End quote ---
Sorry I do not understand, please explain?
Navigation
[0] Message Index
[#] Next page
[*] Previous page
Go to full version