XO Surface Mount Soldering (leadless packages)

[brokensegue]

So I ordered this [1] crystal oscillator package to build a prototype of my circuit. It seems to work as I expected but now I have an issue.

I cannot seem to find any 32.768kHz oscillators in through-hole. For prototyping I hacked up my own breakout board for it but now I'd like to order a PCB and solder the chip down. I'm okish at soldering but this would be by the smallest/hardest chip I've worked with. I'm not sure if you can use a normal iron to solder this kind of packages (the pins are totally hidden under the package). So what equipment/supplies do I need to solder this chip? Hot air? Can I do this without a stencil?

I did some research and this video [2] suggests you can hand solder it normally if it's castellated but I don't think this particular package is castellated (at least by my visual inspection). Would trying this still be easier?

I'm not even sure what this kind of package is called. I can't seem to find a footprint on kicad for it. Is there a standard footprint for this or should I just create my own footprint from the diagram? I know some footprints for hand soldering are different. Should I make the pads extra big?

Thanks for any help.

[1] https://www.mouser.com/ProductDetail/ABRACON/ASEKDV-32768kHz-LC-T?qs=sGAEpiMZZMv0NwlthflBi%2FVa9lmVjdDVxl0ehsuD1Ws%3D
[2]

[ataradov]

Usually they still have some exposed solderable surface on the side. It is not ideal, but possible to use them. If your package does not have anything at all, which often happens with MEMS oscillators, then there are not too many options.

But yes, for better results you need hot air station. No need for a stencil or anything else. Just tin the pads using normal solder and then use hot air station to mount the part. For crystals it is usually pretty easy (compared to QFN and other stuff like this).

Noticed the link. You can clearly see that pad contacts extend to the corners. So the solderable castellations are right on the corners of the devices, not on the sides as in the video.

As for the footprint - you can probably find one, it is more or less standard 2.5x3.2mm package. But most small 4-pin footprints will work, especially for manual soldering.

[wraper]

Usually they still have some exposed solderable surface on the side. It is not ideal, but possible to use them.

From that exposed metalized surface solder will flow to the pads underneath the part and it can be soldered just as well as by hot air. However 3225 package is too small to easily access them with soldering iron. Something like 5032 (5.0 x 3.2 mm) or 7050 is easier to solder without hot air. However I strongly suggest acquiring a hot air station. It's an essential tool these days. Through-hole packaging is essentially dead for many kinds of parts and SMD soldering is not that hard at all.