Author Topic: [wanted] Wire Bonding  (Read 2263 times)

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Offline tnt

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[wanted] Wire Bonding
« on: April 17, 2011, 09:07:50 pm »
Hi,

Does anyone here has a wire bonding machine / access to one and would be willing to provide service (for a fee obviously) ?

I have some BGA ICs soldered on a board that I'd like to probe, and on the 'edge' of it,there is 100 small 'gold' tabs but they're way too small to solder directly so I was thinking a wire bonding machine could be used to bring them to larger test pads ...

Cheers,

    Sylvain
 

Offline jaspel

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Re: [wanted] Wire Bonding
« Reply #1 on: April 26, 2011, 05:38:02 am »
You might have better luck getting it probed for you.  I'd check with a FA lab.
 

Offline tnt

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Re: [wanted] Wire Bonding
« Reply #2 on: April 26, 2011, 08:57:57 am »
Well it's for a long term project ...

I want to experiment with the software on the chip and see the result in HW (don't have full specs/details) so I can't just go probe it once, I need it in continuous at my lab ...
 


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