I wonder if, at some point, these types of components will be more economically embedded in the PCB as part of the fabrication process? Very fre people are going to have the tools to place these types of things, but if there were some sort of "inkjet" type printer that could dispense an amount of resist material to form traces, then you could order your board with the various resistances and capacitances (and inductances) you need printed into the PCB and make life a lot easier.
Probably print transistors in too?
I thought it would be pretty neat to have a "3D printing" sort of process that handles glass composites (like FR4 and related materials), solid metals (build-up, electroplate, laminate-and-etch, etc.), and electromagnetically 'dense' composites (i.e., ferroelectric or ferromagnetic loaded). Placing chip components inside such a construction would probably be easy. You could not only build a very compact, dense circuit board, but do a lot of filtering and power handling without ever touching a discrete capacitor or inductor: even though the composites will have relatively low permeability/permittivity, it will still be enough for basic purposes. 40 pole Bessel filter to "brick-wall" your ADC input? No problem, it's just a bunch of tracks and goop!
Main drawback I think, such a process would be incredibly slow and expensive, at least unless it became a massively mainstream process. The performance or density wouldn't quite be enough to justify it, even for cost-no-object projects. So, Catch-22...
Tim