EEVblog Electronics Community Forum

General => General Technical Chat => Topic started by: Bondguy on December 23, 2016, 09:22:42 pm

Title: Chip on Glass technology
Post by: Bondguy on December 23, 2016, 09:22:42 pm

Does anyone know what technology is used for COG(chip on glass ) technology? How is a chip bonded on the LCD( glass)?
I think it is using Anisotropic Conductive Film (ACF).
But is it possible to remove a (faulty) chip on glass and replace it with a new one?

Title: Re: Chip on Glass technology
Post by: KhronX on December 23, 2016, 09:25:45 pm

What application is this for (or from)?

EDIT: If it's for LCD's, at least according to NXP it is indeed ACF - http://www.nxp.com/documents/white_paper/NXP_COG_WhitePaper.pdf (http://www.nxp.com/documents/white_paper/NXP_COG_WhitePaper.pdf) (page 3)

Replacing it, at least if we're referring to the mechanics of it, may be possible. That being said, i've got a hunch that actually SOURCING a compatible replacement might be the (even) less feasible aspect of it.

Title: Re: Chip on Glass technology
Post by: Bondguy on December 24, 2016, 08:21:25 am

And does anyone have any  experience with that chip of glass technology?

Title: Re: Chip on Glass technology
Post by: SeanB on December 25, 2016, 07:35:01 pm

I know Sharp made a Z80 processor using an amorphous silicon on glass technology, and had working prototypes of it for demonstration, using the glass sheet as a replacement processor in a Z80 machine that they had made for the education market.