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Chips pulled off dumped PCBs and then sold, due to the "chip shortage"?
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SiliconWizard:

--- Quote from: Gyro on September 03, 2022, 08:32:22 pm ---How did I know that one was coming?  ::)


--- Quote from: Faringdon on September 03, 2022, 07:51:11 pm ---Chips like UCC28070A are TSSOP20 and such small parts are ultra ESD sensitive


--- End quote ---

ESD sensitivity is a function of the Silicon, not the package.

--- End quote ---

Well, to be completely fair, there is some impact of the packaging on the consequences of ESD. Typically internal wiring (bonding) between silicon pads and the outside legs introduces a small series inductance which will filter out ESD to some extent. This extent being, in practice, ridiculously small.

While there is some subtle (read: subtle) difference between a large DIP package and a small SMD one, the difference between say a SOIC package and a TSSOP is like uh. You guessed it.
Faringdon:

--- Quote ---While there is some subtle (read: subtle) difference between a large DIP package and a small SMD one, the difference between say a SOIC package and a TSSOP is like uh. You guessed it.
--- End quote ---
Thanks for this.
This is the key point.

A DIP is significantly less ESD susceptible than a TSSOP (ie, a small SMD one). We agree there.
So you would also  extrpolate that a SOIC20 was  also fairly significantly  less ESD damage susceptible than a TSSOP20
langwadt:

--- Quote from: Faringdon on September 04, 2022, 07:42:48 pm ---
--- Quote ---While there is some subtle (read: subtle) difference between a large DIP package and a small SMD one, the difference between say a SOIC package and a TSSOP is like uh. You guessed it.
--- End quote ---
Thanks for this.
This is the key point.

A DIP is significantly less ESD susceptible than a TSSOP (ie, a small SMD one). We agree there.
So you would also  extrpolate that a SOIC20 was  also fairly significantly  less ESD damage susceptible than a TSSOP20

--- End quote ---

is a tiny risk times a random number pulled out of someones rear end fairly significant?
Gyro:

--- Quote from: Faringdon on September 04, 2022, 07:42:48 pm ---
--- Quote ---While there is some subtle (read: subtle) difference between a large DIP package and a small SMD one, the difference between say a SOIC package and a TSSOP is like uh. You guessed it.
--- End quote ---
Thanks for this.
This is the key point.

A DIP is significantly less ESD susceptible than a TSSOP (ie, a small SMD one). We agree there.
So you would also  extrpolate that a SOIC20 was  also fairly significantly  less ESD damage susceptible than a TSSOP20

--- End quote ---

What part of subtle don't you understand? Do the words that people write actually penetrate your internal monologue? ::)
rsjsouza:
Packaging has very little to do with ESD susceptibility. A TO220 MOSFET is almost guaranteed to blow if improperly handled.

As Gyro and others have said, ESD depends on the silicon inside the package, not its size, pin spacing, color, shape, thickness, etc.
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