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Come in through-hole components your time is up!
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PlainName:

--- Quote ---Any arguments about the bonding of the foil to the substrate apply equally well to a through hole part
--- End quote ---

Really? It's as easy to pull a bent and soldered leg back through a hole as it is to peel off a pad?


--- Quote --- but frankly that's irrelevant
--- End quote ---

Though that didn't stop you throwing in that little bon mot. Either it's irrelevant or it's worth making a point, can't have both.
Cerebus:

--- Quote from: dunkemhigh on December 31, 2021, 12:07:07 am ---
--- Quote ---Any arguments about the bonding of the foil to the substrate apply equally well to a through hole part
--- End quote ---

Really? It's as easy to pull a bent and soldered leg back through a hole as it is to peel off a pad?


--- Quote --- but frankly that's irrelevant
--- End quote ---

Though that didn't stop you throwing in that little bon mot. Either it's irrelevant or it's worth making a point, can't have both.

--- End quote ---

You were the one who brought up bonding strength. If I don't answer you point about it you'll say I'm glossing over it, if I do answer it you act as if I brought it up as a fallacious argument. Make your mind up, either is it important, or it's a red herring; you seem to want it both ways depending on whether it bolsters your point of view or not.
Ground_Loop:
There was a time when I absolutely hated surface mount. But after kitting myself out and practicing a bit I now prefer surface mount. Look closely at attached perfboard bottom side pic. They make assembly so much cleaner.
PixieDust:

--- Quote from: Cerebus on December 30, 2021, 11:51:11 pm ---all the mechanically failed through hole parts I've seen it's the actual leads that have broken, not pads.
--- End quote ---

Wow really? Interesting. I presume the failed components were dual lead? I can't imagine a single lead on an IC breaking, but I guess a single lead of a diode for example, well I can see that happening.
Cerebus:

--- Quote from: PixieDust on December 31, 2021, 02:50:35 am ---
--- Quote from: Cerebus on December 30, 2021, 11:51:11 pm ---all the mechanically failed through hole parts I've seen it's the actual leads that have broken, not pads.
--- End quote ---

Wow really? Interesting. I presume the failed components were dual lead? I can't imagine a single lead on an IC breaking, but I guess a single lead of a diode for example, well I can see that happening.

--- End quote ---

Yeah the things with more leads tend to fair better. It's usually poorly supported TO-220s and their ilk  that are the first things to go, then radial electrolytic caps, and only then small resistors, diodes and the like. There's pretty much a direct relationship between the ratio of device mass to total lead area cross-sectional area and the probability of failure. I've only seen these in things designed for relatively light duty applications (or carelessly designed), things intended for harsh environments tend to get the extra attention to ruggedness that they deserve.

The classic culprits? Audio gear designed for domestic use pressed into semi-professional use on the road. Falls apart in no time at all.
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