To be honest, I don't see much of an application for this, though I certainly don't have much industry experience.
A process like this is going to be complex and expensive. The only place where it will make any sense at all is in making high-volume consumer goods, where the sheer number of devices produced can offset the equipment cost. But the trend there has been different - put more stuff into integrated, application-specific chips. How long will it be before a cell phone is one chip with an antenna, a battery, a display and maybe a few inductors and caps hung off it? Then this sort of high-density PCB technology will be pointless.
I doubt it would ever be affordable for low-volume electronics in niche industries, unless it caught on in high-volume industries.
Perhaps it will be useful for a couple years in the interim.
To me, this seems like Rev. B of the hybrid integrated circuit. Sure, they have their applications, but you don't see them much anymore, do you? And they're also almost completely unrepairable, and really haven't killed hobby repair.