Is the package thermally enhanced, i.e. shiny on top so you can get benefit from a heatsink?
Even if not, there's
some value in trying, but it's less obvious how much. (Some TI parts have thermal characterization parameters now, that show the temp difference between an external measuring point and TJ, and thermal resistance to the top, leads, etc. Very useful for figuring these things out!)
A heat spreader alone may be helpful, in which case this is an opportunity to use copper foil/sheet, or even pyrolytic graphite (almost as good a thermal conductor as diamond -- but only in-plane!). You still need grease and clamping.
More likely, just a self-adhesive IC heatsink would do. These are cheap and common, in fin or pin styles, and will handle that power easily enough. If the heatsink needs to be a bit larger (or put up with some abuse), you may find it worth gluing down as well, or getting one with retention clips so it stays put (in which case you can also put other interface material under it; soft rubber pads up to 6 W/mK are available nowadays
).
Tim