I never had a PS3 neither I'm a chip designer but I enjoyed it quite a bit (Perhabs due my own ignorance).
Do you remember that "reballing" epidemic where all 2006-2009 laptops/consoles were failing after just 3-5 years?
This video talks a lot about it, targets mainly the PS3 YLOD/RLOD plague, but applies to most of devices of that era.
Basically new generation chips and existing packaging technology didn't got along, as well several screw-ups along the fabrication chain.
Talks a bit of everything, specially BGA chip packaging like thermals, chip bumping, underfilling ...