Hi all, I'm Matt, I'm an amateur, and I have a few informal (probably kinda newbie) questions which I thought this might be a good place to ask.
1) How come there are specifications for minimal clearances for high voltages, but then high voltage components often have less of a gap between their leads than this, and especially when you look at the clearance between the pads on a PCB, they might seem to be far too close? E.g. There are high voltage (600V+) transistors in TO-220 packages, but the gap between the pins is pretty tight and that between pads if one were to use standard TO-220 packages in software is even moreso?
2) How come there are high power transistors such as IGBTs rated for e.g. Vce=1200V, continuous current=20A, yet they're in plastic packages that don't lend themselves to heatsinking?