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QFN-16 Exposed Thermal Pad Help
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bigjoncoop:
im using a QFN-16 IC.

in the datasheet it states for the exposed pad "Heat sink grounding can not be connected to other potential"

so does this mean i should tie the exposed pad underneath to GND or no?

jpanhalt:
This link shows a completed board with some thermal images.  It appears that center pad is connected thermally and electronically to the ground plane.  Note the 9 vias in the bottom view.

https://lygte-info.dk/review/Review%20Charger%20TP5000%204.2-3.6V%20module%20UK.html
wraper:
It means that GND pad cannot be connected to anything other than GND. If you measure resistance between center pad and GND terminal, most likely they are electrically connected.
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