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QFN-16 Exposed Thermal Pad Help
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Topic: QFN-16 Exposed Thermal Pad Help (Read 662 times)
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bigjoncoop
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QFN-16 Exposed Thermal Pad Help
«
on:
August 11, 2021, 04:33:58 am »
im using a QFN-16 IC.
in the datasheet it states for the exposed pad "Heat sink grounding can not be connected to other potential"
so does this mean i should tie the exposed pad underneath to GND or no?
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jpanhalt
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Re: QFN-16 Exposed Thermal Pad Help
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Reply #1 on:
August 11, 2021, 09:55:55 am »
This link shows a completed board with some thermal images. It appears that center pad is connected thermally and electronically to the ground plane. Note the 9 vias in the bottom view.
https://lygte-info.dk/review/Review%20Charger%20TP5000%204.2-3.6V%20module%20UK.html
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wraper
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Re: QFN-16 Exposed Thermal Pad Help
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Reply #2 on:
August 11, 2021, 09:57:58 am »
It means that GND pad cannot be connected to anything other than GND. If you measure resistance between center pad and GND terminal, most likely they are electrically connected.
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