Author Topic: QFN-16 Exposed Thermal Pad Help  (Read 662 times)

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Offline bigjoncoopTopic starter

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QFN-16 Exposed Thermal Pad Help
« on: August 11, 2021, 04:33:58 am »
im using a QFN-16 IC.

in the datasheet it states for the exposed pad "Heat sink grounding can not be connected to other potential"

so does this mean i should tie the exposed pad underneath to GND or no?

 

Online jpanhalt

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Re: QFN-16 Exposed Thermal Pad Help
« Reply #1 on: August 11, 2021, 09:55:55 am »
This link shows a completed board with some thermal images.  It appears that center pad is connected thermally and electronically to the ground plane.  Note the 9 vias in the bottom view.

https://lygte-info.dk/review/Review%20Charger%20TP5000%204.2-3.6V%20module%20UK.html
 

Offline wraper

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Re: QFN-16 Exposed Thermal Pad Help
« Reply #2 on: August 11, 2021, 09:57:58 am »
It means that GND pad cannot be connected to anything other than GND. If you measure resistance between center pad and GND terminal, most likely they are electrically connected.
 


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