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SO-8 high voltage isolation gap

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radioing:
Hi All,
I use SO-8 IRS2104 half-bridge driver to feed N MOSFETs powered from 400 V DC link. The problem is that the maximal clearance & creepage distance I can reach between Vs (source of high-side MOSFET) and LO (gate of low-side MOSFET) pins is approx. 0.7 mm - too small for 400 V DC. What is the best method to increase insulation between these two SO-8 package pins? Solution which enables driver desoldering in the future (repair) is preferred.
Thanks.

Benta:
Milling a slot in the PCB is a usual method.

tom66:
A bit of conformal coating (with high dielectric resistance) may also help if selectively applied to that area.

Kleinstein:
With the lack of creep distance already at the case, a slot alone would not help. It would be more like potting / conformal coating.

jonpaul:
Normal VL/TUV/VDE clearance , creep and strike is much greater than any SMD can provide.

See applicable directives and compliance regs in the environment and location of the equipment's.

We just Use TH not SMD in safety/isolation areas.

Jon

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