through-hole will never go away as a package technology, though DIP ICs will become harder and harder to find.
SMD will not get a lot smaller as individual packages, but more and more parts will fit into packages of the current sizes.
As previously stated, high-end ICs will get a lot more complex and will have more and more stuff packed in. this is not new and will continue as time goes on.
HOPEFULLY, newer materials and processes will allow a few more leaps of advancement.
I seem to recall that
HP Labs actually produced memristors, which was the final of the four basic, core components in electronics to be realized, the other three being the inductor, the capacitor, and the resistor. So, once those get to production, if it's possible, then we'll likely see some neat new things.